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漆膜附著力測試

Film adhesion testing of thin films and stacks on substrates for material evaluation

3DIC TSV and BWS TTV硅片表面形貌測量

Film Stress薄膜應(yīng)力量測儀

FEOL Electrical Characterization 電學(xué)特性

Thin wafer metrology 晶圓測量學(xué)

Film Adhesion漆膜附著力測試

Film adhesion testing

of thin films and stacks on substrates

for material evaluation.

FSM offers two techniques suitable for low and medium adhesion strength tests.