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硅片表面形貌測量VIT系列

NEW: Virtual Interface Technology for 3D-IC Metrology:

-TSV profile (depth， top & bottom CD， tilt， SWA)

-Residue Detection

-RST

-Copper Nail Height

-Bump Height and Cu pillar height

-Edge trim profile

3DIC TSV and BWS TTV硅片表面形貌測量

Film Stress薄膜應(yīng)力量測儀

FEOL Electrical Characterization 電學(xué)特性

Thin wafer metrology 晶圓測量學(xué)

Film Adhesion漆膜附著力測試

NEW: Virtual Interface Technology for 3D-IC Metrology:

-TSV profile (depth， top & bottom CD， tilt， SWA)

-Residue Detection

-RST

-Copper Nail Height

-Bump Height and Cu pillar height

-Edge trim profile