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Laserino二合一激光綜合測(cè)量系統(tǒng)

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光傲科技股份有限公司

美國(guó)

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面議

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584

產(chǎn)品介紹

業(yè)界首臺(tái)基于波前探測(cè)技術(shù)的，全面同時(shí)測(cè)量激光光束laser beams、光斑分布beam-profiling 的二合一激光測(cè)試設(shè)備。全面評(píng)價(jià)激光品質(zhì)：

基于波前分析的激光失常測(cè)試Aberrations obtained from the wavefront sensor
M² 測(cè)試，通過光斑光強(qiáng)分布得到measurement of the beam-quality using the beam-profiler
激光束腰，位置、發(fā)散角Measurement of beam-waist， position of beam-waist and divergence angle
高斯形貌Fit of Gaussian profile to image
在線調(diào)整激光，對(duì)焦、對(duì)準(zhǔn)Real-time adjustment of laser (up to a speed of 900 Hz using a sub-window)
對(duì)激光元件，透鏡、鏡片測(cè)試Measure the optical quality of lenses， mirrors etc

有兩種型號(hào)以適合不同波長(zhǎng)使用 0.4 μ to 1.1 μ and NIR 0.9 μ to 1.7 μ

Laserino-Pro-Vis

Wavefront sensor with fixed collimator that can be used in external illumination mode in white-light or laser
Two uncooled cameras allow the complete control of laser beam: the first camera is used for wavefront analysis ， the second camera for imaging beam-profile of laser
Front flange allows easy mounting and dismounting of lenses and collimators
Standard sampling: 30 x 30 spots
For testing lasers from 0.4 μ to 1.1 μ
Φ max=6.7mm (without beam-expander)
Φ max=58.0mm (with BE60)

Laserino-ProIR

Wavefront sensor that can be used in external illumination mode with laser
One uncooled Lead oxysulfide Vidicon camera can be switched from wavefront analysis to beam-profiler to get a complete picture of the laser beam
Front flange allows easy mounting and dismounting of lenses and collimators
Maximum sampling: 20 x 20 spots
For testing lasers from 0.4 μ to 1.8 μ; optimized in the wavelength range:
0.7 μ to 1.8 μ
Φ max = 8.0 mm (without beam-expander)
Φ max = 58.0 mm (with BE60)

Sensoft: The wavefront sensor based instrument comes with Sensoft Laserino， the Shack-Hartmann wavefront sensor control and analysis software optimized for laser. The package is available under any Windows operating system (2000/XP).

All the features of Optino-EE30
Laser beam 3D and contour profile in real-time
Fit of Gaussian profile to image
Best focus determination based on analysis of beam diameter
Real-time adjustment of laser (up to a speed of 900Hz using a sub window)
M² measurement of the beam-quality using the beam-profiler
Measurement of beam-waist， position of beam-waist and divergence angle

Laserino 激光波前測(cè)試技術(shù)指標(biāo)

Feature		Specification
Type of element that can be tested		Lasers from 0.4 μ to 1.1 μ with Laserino-ProVis wavefront sensor Lasers from 0.9 μ to 1.7 μ with Laserino-ProNIR wavefront sensor Optical elements with external illumination
Diameter of optical element that can be tested⁽¹⁾		Practically any diameter
Diameter of lenslets⁽²⁾		0.2 mm
Focal length of lenslets⁽³⁾		22 mm for Laserino-ProVis wavefront sensor， 11 mm for Laserino-ProNIR wavefront sensor
Standard sampling on the pupil⁽⁴⁾		30 x 30 spots
Maximum sampling⁽⁵⁾		100 x 100 spots with large format camera
Analysis Software		Sensoft
Repeatability of measurement of Zernike polynomials⁽⁶⁾		< λ/300 rms
Rms repeatability of wavefront measurement⁽⁷⁾		< λ/200 rms
Absolute precision⁽⁸⁾		Depends on the surface quality of the reference optical element. Typically λ/20 - λ/100
Wavelength range (visible camera)⁽⁹⁾		0.375 μ - 1.1 μ with standard camera
Wavelength range (IR camera)⁽¹⁰⁾		0.9 μ - 1.7μ
Tilt measurement accuracy (angle depends on the size of the optical elements)		4 μ rad
Dimensions		9 (H) x 22 (L) x 9 (W) cm.
Power requirement (Vis Fiber optic light source)		120V or 220V
Power requirement (stepper motor)		12 V， 500 ma.
Height of optical axis from base		65.5 mm

Notes and explanations for the specifications table: (1) With the appropriate auxiliary optics， optical elements of almost any diameter can be tested (2) Lenslets with different diameters available on request (3) Lenslets with different focal lengths available on request (4) With the standard CMOS camera (chip size 6.8 x 8.6 mm²). Pixel size: 6.7μ (5) Depends on the chip size of the camera. In Optino wavefront sensor， the camera is mounted externally， and can be changed easily. For details， see separate section (6) Repeatability of measurement obtained by combining 100 SH images taken in succession. The error of this coefficient depends on the sampling used for obtaining the SH image (7) Repeatability of measurement obtained by combining 100 SH images taken in succession (8) This will determine the final accuracy of the measurements， as the SH test is a differential test (9) Other cameras with an extended range can be used (10) Other cameras with an extended range can be used

激光光斑、光束分析技術(shù)指標(biāo)

Feature		Specification

Type of element that can be measured		Lasers from 0.4 µ to 1.1 µ with Laserino-ProVis wavefront sensor Lasers from 0.9 µ to 1.7 µ with Laserino-ProNIR wavefront sensor

Resolution of imaging lens motor		21 µ per step

Accuracy of determination of beam waist diameter		± 2 %

Accuracy of determination of beam waist location		± 8 % of beam Rayleigh distance

Accuracy of determination of M²: Beam quality		± 5 %

Accuracy of determination of divergence angle		± 5 %

Divergence range measurement 632 nm		0.5 mrad to 20.0 mrad (with beam-expander)

Divergence range measurement 1550 nm		1.2 mrad to 50.0 mrad (with beam-expander)

Max Beam diameter		23 mm

Clip levels		User selected (continuously variable)

Diameter computation		Gaussian or second moment

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