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規(guī)格：

    高純鉛：99.999% Pb-5N-I-10

    檢測雜質(zhì)：Ag, Al, As, Bi, Cd, Fe, Mg, Ni, Sb, Sn, Zn

    雜質(zhì)總含量：≤10ppm

    高純鉛：99.9999% Pb-6N-I-11

    檢測雜質(zhì)：Ag, Al, As, Bi, Cu, Fe, Mg, Sn

    雜質(zhì)總含量：≤1ppm

    高純鉛：99.99999% Pb-7N-I-44

    檢測雜質(zhì)：Ag, Al, Bi, Cd, Cu, Fe, Mn, Ni, Sn, Zn

   雜質(zhì)總含量：≤0.1ppm

用途：主要用于制備化合物半導(dǎo)體、致冷元件、紅外光電轉(zhuǎn)換器件、高效溫差元件以及焊料等。

包裝：滌綸薄膜包裝后雙層復(fù)合膜真空封裝或直接玻璃管真空包裝。

Specification:

 High purity Pb: 99.999% Pb-5N-I-10

 Testingimpurity: Ag, Al, As, Bi, Cd, Fe, Mg, Ni, Sb, Sn, Zn

Total impurity content: ≤10ppm

 High purity Pb: 99.9999% Pb-6N-I-11

 Testing impurity: Ag, Al, As, Bi, Cu, Fe, Mg, Sn

Total impurity content: ≤1ppm

High purity Pb: 99.99999% Pb-7N-I-44

Testing impurity: Ag, Al, Bi, Cd, Cu, Fe, Mn,Ni, Sn, Zn  

Total impurity content: ≤0.1ppm

Application: Leadis primarily used in the manufacture of compound semiconductor, refrigeratingelement, infrared photoelectric converting device, high efficientthermo-element and solder etc.

Package: Packedwith terylene film, and double poly-film with vacuum encapsulation. Packed withglass tube with vacuum encapsulation directly.