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S2130

S2130/S2130JB

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型號(hào)：

S2130/S2130JB

關(guān)注度：

1643

產(chǎn)品介紹

產(chǎn)品性能：

Remarks:

1. Specification sheet: IPC-4101/12, is for your reference only.

2. All the typical value is based on the 1.6mm specimen.

3. All thetypical values listed above are for your reference only and not intended forspecification. Please contact Shengyi Technology Co., Ltd. for detailedinformation. All rights from this data sheet are reserved by Shengyi TechnologyCo., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ andthe third digit the relative humidity.

Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	130
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	—
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	60
			After Tg	ppm/℃	340
			50-260℃	%	5.2
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	30S No delamination
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	2.9 x 10⁸
Volume Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ.cm	8.6 x 10⁶
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	2.8 x 10⁷
Surface Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ	4.8 x 10⁶
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	115
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	45+kV NB
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.6
Dissipation Constant (Dk)
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.016
Dissipation Factor (Df)
Peel Strength(1Oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.9
			125℃	N/mm	1.7
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	400
Flexural Strength	CW	IPC-TM-650 2.4.4	A	MPa	320
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.11
CTI		IEC60112	A	Rating	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
Flammability		UL94	E-24/125	Rating	V-0

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