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OAI的面板級掩模光刻機 Model 6020S，

用于FOPLP型號6020S -半自動化或自動化，實現(xiàn)500mm x 500mm晶圓尺寸的FO-PLP加工.

OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated

Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes

OAI掩模對準(zhǔn)器，不同的印刷方式

距離: 間隙可設(shè)置在一個非常寬的范圍內(nèi)，增量精度1μM

軟接觸: •基材被帶入非常柔軟的機械接觸曝光時的掩模。通過接觸力可調(diào)軟件設(shè)置

金屬觸點: •接觸額外的氮氣壓力

真空接觸: •真空級別控制接觸力。真空度為由用戶設(shè)置

OAI Mask Aligners

Various Printing Modes

PROXIMITY:

• THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN INCREMENTAL PRECISION OF 1μM

SOFT CONTACT:

• SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL CONTACT WITH THE MASK DURING EXPOSURE. THE CONTACT FORCE IS ADJUSTABLE VIA SOFTWARE SETTINGS

HARD CONTACT:

• CONTACT WITH ADDITIONAL N2 pressure VACUUM CONTACT:

• VACUUM LEVEL CONTROLS THE CONTACT FORCE. LEVEL OF VACUUM IS SET BY USER